CMP, also referred to as thermal oxidation sprucing, makes use of MP along side chemical compounds to enhance the MRR and improve area high-quality [twenty]. Figure 2 illustrates the schematic of a normal CMP process [21]. The SiC wafer, that is fixed on the carrier, along with the polishing pad https://www.facebook.com/permalink.php?story_fbid=pfbid0vuY47mVAJy6xu3SK1ZxACHZWQJconX3a8FZ1nP6MPCJj8jnt6HRFfFSx3j9vpWNpl&id=61560512640678&__cft__[0]=AZVDbNnu3CjtxHSY7qE5yeUdbf2iZFPQ77yTbG4L6ETD8leJZVrh4RP1V1J7fx2IzIMkkDHq4lypRIeeGEt6DIWzKIQONSLdaKlt3woU4TMQVDcew55M0oeg7MvgCCeX73fEpms5TgjZsCMepgKV2x93V0lUBAE_ptCP_rGSeiTEByRadw4LGB1MNht3SjN5G_rBIGZX76xgWrE5JzWy1CzT&__tn__=%2CO%2CP-R